Solar-B EIS
MULLARD SPACE SCIENCE LABORATORY
UNIVERSITY COLLEGE LONDON |
Author: A M James |
Progress
Meeting at RAL 02 – 27/6/01
MSSL/SLB-EIS/MN008.01
Attendees: Jim Lang, Barry Kent, Graham Toplis, Chris Castelli, Chris Goodall, Alec McCalden, Tony Dibbens, Graham Willis and Ady James
A further requirement has come to
light from McLaren such that the panels need to undergo stress relief before
been assembled. This would involve a further 7 days in the schedule. If the
thermal vacuum chamber at RAL had to be used this would also require an
additional bake-out to clean the panels. Suggestions were made for how to do
this thermal cycling, noting that it was not necessary to do this under vaccum.
It was felt that we needed to know more what this stress relief was doing and
whether a smaller temperature range could be used (see Action 546). [subsequent to the meeting an e-mail
correspondence from Andy Taylor suggested a temperature range of room
temperature to +140 °C may
be suitable]
Further to Action 534 last from the last meeting Graham Toplis felt that the blue tank at RAL would be suitable to do the first bakeout of the structure.
Now that the type of thermal sensor (T type Thermistors) has been clarified it is found that this type is that normally used at RAL. Graham Toplis gave Alec, Graham Willis and Chris Goodall a tour of the facilities to held them understand the requirements for the harnessing etc.. Graham Toplis agreed to supply the necessary 2 pin connectors to Graham Willis.
[I believe that these will have to be continuous through the chamber wall so that there is no break at EIS at all. How does this fit in with the desire to use the MTM/TTM to monitor cleanliness etc. ? How are these thermistors coming out? Does this upset the purge paths? Were we intending to purge this model?]
Some disccussion was had. Basically it is important that Chris Castelli and Graham Toplis are in regular contact with each other to monitor this situation.
Chris Goodall, Alec and Graham Willis had a short meeting to discuss the build of the MTM/TTM. My understanding is that the number and position of the thermal sensors and heaters was discussed, the outstanding issue was how many of these sensors are internal.
No. |
By Whom |
By When |
|
544 |
AJM/GW |
29/6/01 |
|
545 |
JL |
6/7/01 |
|
546 |
CMC |
6/7/01 |
|
547 |
CVG/AJM |
6/7/01 |
Next Meeting: 25th July 2001 Room R25 1.13,
11.00